Resonant signs deal with component vendor
Goleta-based electronics manufacturer Resonant announced on Sept. 5 that it had signed an agreement with a component vendor and surface acoustic wave device foundry.
The agreement is part of the company’s Infinite Synthesized Network Foundry program and incorporates the vendor’s chip scale packaging and wafer level packaging capabilities, the company said in a news release.
“We continue to de-risk our go-to-market strategy by providing alternatives in the mobile supply chain,” said CEO George Holmes. “This agreement with a leading foundry, which is also qualified at tier one vendors, helps extend our fabless filter model eco-system and offers yet another choice to our fabless model customers.”
Resonant had previously announced the addition of a new customer Aug. 31, bringing it up to eight. Terms for the development and licensing agreement were not disclosed. Shares for the company were up around 10 percent to close Sept. 5 at $4.77.
